Wafer Resizing

Article provided by: Laserod Technologies, LLC

Wafer Resizing

Semiconductors continue to require increasingly complex manufacturing techniques. Wafer resizing allows you to slice semiconductors to fit a variety of different types of products. Laserod uses cutting edge pico and femto laser technologies to cut at a micro-level with precision and accuracy.

The increasing complexity of semiconductor wafers

Semiconductors are a vital component in the production of circuits. Wafers are formed from a highly pure crystalline material and contain the conductivity required for fast computing.

Since wafers are typically circular due to the use of silicon ingots, cutting them requires precision and care. As sizes decrease, precision instruments are needed to create a useful product.

What are the methods used for cutting semiconductor wafers?

Manufacturers accomplish cutting using a water jet or a laser. Both processes are completed in an open-air environment with the aid of an edge bevel.

Operators or software enter coordinates into a special machine that directs the process of reshaping the material. Each process is used to trim and notch wafers to fit the large variety of machines on the market today.

Why should I use laser wafer resizing?

Laser resizing operates at a high pulse rate within a narrow bandwidth. This prevents overcutting or improper notching, giving a fine-tuned degree of control.

Using a laser also avoids the use of an invasive waterjet, reducing the risk of damaging the semiconductor. The device produces heat but only within the correct tolerance limits, leaving a freshly trimmed edge with a diameter tolerance of 0.05mm.

How is a semiconductor protected from contamination on resizing?

In general, resizing is a safe procedure that does not damage the material. A vacuum collects particles and dust as the laser or jet moves across your wafer.

It is possible to use a layer of photoresist to further reduce contamination. The practices allow your wafer to remain in impeccable condition.

How precise is solid state laser cutting?

Solid state laser cutting works at a smaller wavelength than comparable methods. Where CO2 produces more than one micron of variance, solid state lasers achieve .10 microns of variance.

This accuracy grants Laserod extreme precision in any process. Tolerance on notches and flats is within 0.025 mm.

How thick can a silicon wafer be to be resized?

Machining tools do have limits. Width and diameter must be considered before scheduling manufacturing.

Laserod machines handle downsizing from 300mm max diameter to any smaller size. Our equipment handles wafers up to 2mm in thickness.

Wafer resizing

Wafer resizing allows you to fit semiconductor wafers to your devices. Laserod uses precise and accurate solid-state lasers to accomplish results within small tolerance ranges.

Over forty years of experience gives us an edge. We are currently working with the University of Stanford to produce the new South Pole telescope capable of peering deep into the universe.

When your project calls for special semiconductor wafer sizes and notches, we can help. Get in touch with our team today to find out how solid-state laser cutting works today.

Wafer Resizing
Laserod Technologies, LLC
20312 Gramercy Pl
Torrance CA 90501 US

View Larger Map